The horse is made ready for the day of battle, but victory rests with the Lord.

Proverbs 21:31

Scott
Anson, Ph.D., P.E.

Phone: 903.233.3953
Email: ScottAnson@letu.edu

  • Department Chair, Mechanical Engineering

  • Professor, Mechanical Engineering


As Department Chair of Mechanical Engineering I have the privilege of leading and serving the Faculty and Staff who serve our students.  At approximately 210 students, Mechanical Engineering is blessed to be one of the largest residential programs on the LeTourneau campus.  Even with our size, we have wonderful opportunities to get to know students and provide opportunities for academic, professional and personal growth.  Our faculty are here because they wanted to work at a Christian, teaching focused university.  I am honored to serve alongside my colleagues in Mechanical Engineering, School of Engineering and Engineering Technology and all LeTourneau University.  Together we are excited to witness the work that God does in the lives of young women and men at LeTourneau!  Please get to know us and reach out if I can be of help to you.

EDUCATION

  • Ph.D. Systems Science, Binghamton University, 2007
  • M.S. Mechanical Engineering, Binghamton University, 1996
  • B.S. Mechanical Engineering SUNY Binghamton, 1993
  • A.S. Engineering Science, Broome Community College, 1991
  • Licensed Professional Engineer, TX and NY
  • Certified by American Petroleum Institute (API) 571 in Corrosion and Materials
  • Trained and experienced in ASME/API 579 Fitness for Service Assessment

EXPERIENCE

2013-Present

LeTourneau University
Professor of Mechanical Engineering

2003-2013

Rochester Institute of Technology
Manufacturing Engineering Technology Program Chair, Associate Professor

2009-2013

IEC Electronics, Inc.
Adjunct Director of Technology

2008-2013

Journal of Applied Science and Engineering Technology
Editor-in-Chief

2002-2003

Endicott Interconnect Technologies Inc.
Advisory Engineer, Process Development and New Process Introduction

2001-2002

IBM Microelectronics
Advisory Engineer, Process Development and New Process Introduction

1996-2001

Universal Instruments
Process Research Engineer

1995-1996

EMS Technologies
Process Engineer

Courses Taught

  • Senior Design
  • Mechanical Engineering Lab 1
  • Materials Engineering
  • Cornerstones (Freshman college foundation course)
  • Engineering Economics
  • Principles of Mechanical Design
  • Statics lecture and lab
  • Strength of Materials Lab
  • Computer Aided Manufacturing Lab
  • Process Design
  • Robotics Applications
  • Electronics Manufacturing
  • Failure Analysis in Electronics Packaging
  • Advisor on MS Theses
  • Committee Member on MS Theses

RESEARCH INTERESTS

Materials

  • Oil and gas equipment damage mechanisms
  • Failure analysis
  • General materials

Professional Practice

  • Integration of faith and work
  • Leadership
  • Engineering Education

Emergency Energy

  • Rocket stove optimization by Design of Experiments (DOE)
  • Electrical power generation by conversion of thermal energy

Personal Bio

I greatly enjoy being a Christian and a Mechanical Engineer.  In my case, both transitions occurred during the same season of life, as I trusted Christ while I was an undergrad pursuing a degree in Mechanical Engineering. I am both a first-generation Christian, and first-generation college student.  Now I greatly enjoy studying phenomenon, and see it as thinking God’s thoughts after Him.  As Engineers we get to think, study and reason, and understand more fully how God has created the world.  I thoroughly enjoy the reasonableness of faith in Christ. 

 Beyond my academic work, I enjoy practicing as an Engineer doing work in failure analysis, product design, expert witness, personal injury litigation, oil and gas analysis including API 579 Fitness for Service and pressure vessel derating. I feel it makes me a more effective professor and I don’t want to be telling the same 20-year-old industry stories 15 years from now, just as much as I imagine those students will not want to hear them.

 In my free time I deeply enjoy spending time with the bride of my youth, Taryn, and our two dear children.  Thanks to her I am a better man and appreciate the charm of delicate detail on an antique transferware teacup.  Together we relish the wonder of how God has made each of our children as a blend of us with their own unique characteristics.  We love them dearly and learn much from each of them.  I also enjoy hunting (especially hogs) and target shooting.  I count it a blessing to live in Texas.

Christian Higher Education Publications

  • “Philosophy of Teaching and Student and Peer Mentoring: A Christian Perspective”, 2017 Christian Engineering Conference, Cedarville OH, June 28-30, 2017
  • “Developing a Philosophy of Teaching and Student Mentorship: A Christian Perspective” Faculty Workshop, LeTourneau University, Longview TX, August 15, 2017

Publications

  • “An Examination of the Parameters Affecting (Solder Paste) Tack Strength as Measured in the IPC Tack Test”, with C. Sahay, L. Head and J. Constable, ASME International Mechanical Engineering Congress & Exposition, Winter Annual Meeting, San Francisco, CA, 95-WA/EEP-20, Nov. 12-17, 1995
  • “An Examination of the Factors Affecting the Measurement of Solder Paste Tackiness”, Master of Science Thesis, Department of Mechanical Engineering, Thomas J. Watson School of Engineering and Applied Science, Binghamton University (State University of New York), Binghamton, NY, Jan., 1996
  • “Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach”, with C. Sahay, Linda Head, and James Constable, “American Society of Mechanical Engineers (ASME) Journal of Electronics Packaging”, Vol. 118, No. 2, pp. 94-100, June 1996
  •  “Qualifying a Hi-Rel No-Clean Process“, with C. Sahay, John Hallgren, Walter Pillar, Tom Fletcher, Russell   Davis, Tek Ong, “SMT - Surface Mount Technology Magazine”, pp. 116-122, August 1996
  • “Qualifying a Hi-Rel No-Clean Process“, with C. Sahay, John Hallgren, Walter Pillar, Tom Fletcher, Russell   Davis, Tek Ong, reprinted in  “SMT’s Guide to Soldering Materials”, Nov. 1997
  • ”Failure Analysis for Area Array Packages, Part I”, HDI, Vol. 4, No. 8, pp 24-26, Aug. 2001
  • ”Failure Analysis for Area Array Packages, Part II”, HDI, Vol. 4, No. 9, pp 32-36, Sep. 2001
  • “Failure Analysis Techniques for Area Array Packages”, IMAPS Advanced Technology Workshop on Chip Scale Packages, North Falmouth MA September 22-24, 2000
  • “Solder Paste Wetting and Solder- Balling Evaluation: A Quantitative Statistical Approach Using DOE”, with Vijay Gopalakrishan, Robert Murcko and Krishnaswami Srihari, APEX Electronics Assembly Process Exhibition and Conference, Anaheim CA February 2003
  • “Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach”, with Subrahmania Janakiramin, James Holton, Robert Murcko and Krishnaswami Srihari, APEX Electronics Manufacturing Conference 2004, Anaheim CA, Feb 21-26, 2004
  • “Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures”, with Vijay Gopalakrishan, Robert Murcko and Krishnaswami Srihari APEX Electronics Manufacturing Conference 2004, Anaheim CA, Feb 21-26, 2004
  • “Investigation of Lot Variation on Moisture Sensitivity and its Impact on Delamination Phenomenon in Plastic Encapsulated Components”, with Karthik Thenalur and S. M. Ramkumar.  Electronic Circuits World Convention (ECWC) poster presentation Anaheim CA, February 22-24, 2005
  • “Effect of Deviating From The Reflow Process Window for Lead-free Assembly”, with Santhakumar Rajesnayagham, Manivannan Sampathkumar, Riyaz Shaikh, S. M. Ramkumar, Bjorn Dahle, Miles Moreau.  Proceedings of Surface Mount Technology Association (SMTA) International Conference Chicago, Sept. 25-29, 2005
  • “Investigating the Performance of SAC and SACBi Solder joints with Immersion Silver and OSP Surface Finishes” with  M. Sampathkumar , S. Rajesnayagham, and  S. M. Ramkumar.  Proceedings of Surface Mount Technology Association (SMTA) International Conference Chicago, Sept. 25-29, 2005
  • “Effect of Deviating from the Thermal Process Window for Lead-free Assembly”, S. Rajesnayagham, M. Sampathkumar, R, Shaikh, S. M. Ramkumar, B. Dahle, M. Moreau.  Journal of Surface Mount Technology, Vol. 18, Issue 4, p. 29, October –December 2005
  • “Teaching Reliability Concepts to Undergraduate Students – an NSF CCLI A&I Grant”, S. M. Ramkumar, Charles Swain, Arun Varanasi, American Society for Engineering Education (ASEE) 2006 Annual Conference and Exposition, Chicago IL, June 18-21, 2006
  • “Analysis of Solder Wetting in Sn-Ag-Cu Lead Free Alloy”, with Krishnaswami Srihari and Jacob G. Slezak, 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, IL, November 5-10, 2006
  • ”Analysis of Lead Free Tin-Silver-Copper and Tin-Lead Solder Wetting Reactions” Ph.D. Dissertation, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, Binghamton University (State University of New York), Binghamton, NY, May, 2007
  • “Reflow Process Enhancement and Wetting Analysis in 63Sn/37Pb and Sn-Ag-Cu Lead Free Alloy, with  Krishnaswami Srihari and Jacob G. Slezak, 2007 Surface Mount Technology Association International (SMTAI) Conference, Orlando FL October 7-11, 2007  
  • “Organic Solderability Preservative Lead Free Reflow Processing” with Jacob G. Slezak, 2007 Surface Mount Technology Association International (SMTAI) Conference, Orlando FL October 7-11, 2007
  • “Investigation of Enhanced Solder Wetting in 63Sn/37Pb and Sn-Ag-Cu Lead Free Alloy”, with Krishnaswami Srihari and Jacob G. Slezak, Electronic Components and Technology Conference (ECTC) May 27-30, 2008
  • “REAL – Reliability Education and Analysis Laboratory”, with S. M. Ramkumar, American Academy for Advancement of Science / NSF CCLI Conference in Washington D.C., August 13-15, 2008 
  • “Focusing on Student Involvement & Best Practices”, with Roy Starks and Matt Seal, SMTA Chapter Officers Webinar, Feb. 25, 2009
  • “Navigating the Process of Publishing in a Journal”, Letter from the Editor-in-Chief, Journal of Applied Science and Engineering Technology (JASET), Volume 3, Sept. 2009
  • “Navigating the Process of Publishing a Journal Article”, seminar – RIT Wallace Library, Publishing and Scholarship Support Center, Open Access Week, Oct. 29, 2009
  • “Advice for Authors of Journal Articles”, RIT- CAST Scholarship, Brown Bag Session RIT, Oct. 26, 2009. • “Accelerating Untenured Faculty Scholarship”, with Mario Castro-Cedeno, Elizabeth Dell, Robert Garrick, Christopher Greene, James Lee, Carol Romanowski, Michael Slifka, Larry Villasmil, 2010 Conference for Industry and Education Collaboration (CIEC), Palm Springs,  CA, Feb. 3-5, 2010
  • “UFAST – Practical Advice for Accelerating New Faculty Scholarship”, with Robert Garrick, Mario Castro-Cedeno, Elizabeth Dell, Christopher Greene, James Lee, Carol Romanowski, Michael Slifka, Larry Villasmil, 117th Annual Conference and Exposition, American Society for Engineering Education (ASEE), Louisville, KY, June 20-23, 2010
  • “Peer Mentoring: Untenured Faculty Accelerated Scholarship Team (UFAST)”, RIT Peer Network Fall Session, Presentation and Panel Discussion, Nov. 11, 2010
  • “Peer Mentoring: Untenured Faculty Accelerated Scholarship Team (UFAST)”, RIT Peer Network Winter Session, Presentation and Panel Discussion, Jan 28, 2011
  • “Restructuring the Robotics Laboratory and Enhancing the Robotics Curriculum”, with Christopher M. Greene and Christopher Villareale, 2011 ASEE Annual Conference & Exposition, June 23-29, 2011
  • “How to Advance from a Manuscript Submitter to a Journal Article Author”, New York State Engineering Technology Association, Rochester NY, October 25, 2012
  • “Evaluation of Solder Pastes for High Reliability Applications”, with Michael McLaughlin and Abner Argueta, Presented at Surface Mount Technology Association International (SMTAi) Fort Worth TX, October 12-17, 2013
  • “An Insider’s View of the Journal Article Publication Process:  A Former Editor-in-Chief’s Perspective”, LeTourneau University, Longview TX, April 16, 2014.
  • "Why Engineer? – A Biblical Analysis of the Engineering Profession”, Christian Engineering Conference – 2015, Seattle WA, June 2015.
  • "Scholarly Production of an Untenured Cohort of Faculty", Journal of Engineering Technology (JET), Vol 32, Issue 2, September 2015.
  • “Philosophy of Teaching and Student and Peer Mentoring: A Christian Perspective”, 2017 Christian Engineering Conference, Cedarville OH, June 28-30 2017.
  • “Developing a Philosophy of Teaching and Student Mentorship: A Christian Perspective” Faculty Workshop, LeTourneau University, Longview TX, August 15, 2017
“Intermetallic Effects in Aluminum-To-Steel Friction Stir Welds”, ASTM Symposium Commemorating 100 Years of E04 Development of Metallographic Standards, Atlanta GA, November 15-16, 2017.

Presentations of a three-hour workshop on failure analysis techniques

  • “Failure Analysis Techniques for Process Engineers: Principles, Methods and Case Studies”, Workshop at APEX, Long Beach CA, March 2000
  • “Failure Analysis Techniques for Process Engineers: Principles, Techniques, and Case Studies”, Workshop at Mexitronica, Guadalajara, Mexico, October 2000
  • “Failure Analysis Techniques for Process Engineers: Principles, Methods and Case Studies”, Workshop at Binghamton University Packaging Assembly Symposium, Binghamton NY, November 2000
  • “Failure Analysis Techniques for Process Engineers: Principles, Methods and Case Studies”, Workshop at APEX, San Diego CA, January 2001